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Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics

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Zhengzhou Hongtuo Superabrasive Products Co., Ltd.

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Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics

Brand Name : HT

Model Number : HT-RE

Certification : ISO9001:2015

Place of Origin : China

MOQ : 2

Price : Price negotiable

Payment Terms : T/C,T/T

Supply Ability : 300/pcs per month

Delivery Time : 2-3weeks

Packaging Details : Carton Box

Dicing Objects : Optical glass, ceramics, ferrites, crystals

Size : Customize

Abrasive : Diamond

Bond : electroplated

Thicness : 0.16mm

Color : Grey

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Electroplated bond HUb blades for silicon wafer,wafer compounds,ceramic

HT series of dicing blades cutting blade is high performance and high quality priduction with new electroforming technology made,can be widely applied in semiconductor wafer,semiconductor resistor,cerami,plastic sealing material.

Free samples available

Features

1.ultra thin design,can be used to deepen cutting and slotting precessing.

blade thickness range of 0.015mm -0.3mm.

Applications

silicon wafer,wafer compounds,ceramic ,sealed plastic materials,

Related Technical Parameters

O.D		Thickness			I.D
Size	Tolerance	Size	Standard tolerance	High precision tolerance	Size	Tolerance
50~ 100	+0.02	0.1~≤ 0.15	±0.005		25.4 30 31.75 40 60 80 88.9	+0.02~ 0
		0.15~≤ 0.25	±0.005	±0.003
		>0.25	±0.01	±0.005

more pictures for you review

Product Tags:

wafer dicing saw

disco dicing blades

Electroplated Bond HUb Blade For Silicon Wafer , Wafer Compounds , Ceramics Images

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